Evolution of fingerprint authentication system from Shenzhen, China

Fingerprint authentication functions are now commonplace in smartphones and various devices. With the development of technology, if more than simple unlocking and personal identification purposes are born, what value will be created, what will lead to the solution of social issues, and how to make our lives convenient. There are start-up companies in Shenzhen, China that offer a new approach.

TSING TECH’s ultrasonic fingerprint sensor is based on the principle of capacitance MEMS ultrasonic transducer array technology, which is the world’s leading 3rd generation fingerprint sensor technology, that can fill the gap in the fingerprint sensor field. TSING TECH’s fingerprint sensor integrates special IC for signal processing. The whole system chip has advantages of miniaturization, high integration, high precision and can be mass manufactured. The Key to TSING TECH’s technology is that it is able to obtain three-dimensional details and unique fingerprint data that cannot be obtained by the current traditional fingerprint technologies. Meanwhile, ultrasounds can penetrate the epidermis of finger skin to obtain the subcutaneous biological information of the fingerprint, which can greatly improve the information security.

Current fingerprint tech mainly are capacitive, optical principles which have several disadvantages.
・They can be easily affected by liquid and grease
・They won’t give detailed information in certain situations

However, TSING TECH’s product can obtain three-dimensional fingerprint feature data and personal fingerprint biometric information that the current traditional fingerprint technology cannot. These unique characteristics can greatly improve information security. TSING TECH’s ultrasonic fingerprint sensor can penetrate glass, plastic, other materials, and can be placed under a screen or mobile phone to complete fingerprint scanning, providing convenience for the terminal design of mobile phone manufacturers.

TSING TECH has also built a cMUT chip structure made with silicon-based MEMS micromachining technology, which can achieve high-density array element integrated manufacturing, realize great matching between silicon material and human body dielectric impedance, and has the advantages of wide band and high electromechanical conversion efficiency. Silicon MEMS technology enables the cMUT chip to break through the technical bottleneck of piezoelectric transducers, accomplish the fabrication of high-performance, low-cost and high-density transducer arrays, that overcomes the technical bottleneck of traditional piezoelectric ultrasonic transducers in large array manufacturing, and meets the needs of portable medical ultrasonic imaging equipment and ultrasonic imaging system in consumer electronics.

In 2026, the market will reach 9 billion US dollars, which is now 5 billion dollars. In these markets, TSING TECH’s 3D biosecurity fingerprint sensors and hand-held ultrasound equipment could revolutionize the industry.