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Visualization of Carbon Footprint and Origins of Recycled Materials

～ Improve the environmental value of recycled materials by utilizing blockchain technology ～

Background
  • The recycled products market is expected to continue to expand due to increasing environmental awareness and the strengthening of laws and regulations.
  • Disguised production areas and human rights issues in the country of manufacture have become social issues, and it is extremely important to corporate activities to know the origin of products and how they were manufactured.
  • Additionally, many companies are working on reducing their carbon footprints, or the total amount of greenhouse gas emissions generated in a series of product lifecycles.
  • However, the reliability of data on recycled materials is uncertain due to the large number of companies involved in the recycling process.
Project Overview
  • The platform being built as part of this project utilizes highly-reliable blockchain technology that is also used in the financial industry.
  • Fujitsu and Teijin have jointly launched this project to visualize the value chain from manufacturing to recycling of products using blockchain technology (see figure below).
  • By utilizing this platform, we believe the following can be realized:
①Reliable procurement of recycled materials
Specifying the origin of the materials, companies and countries involved in the recycling process makes it possible to procure reliable recycled materials.
②Reliable carbon footprint
Visualizing the CO₂ emitted in each value chain related to recycling makes it possible to calculate a highly accurate carbon footprint.
③Added value to recycled materials
For example, since recycled materials collected from aircraft were required to have higher specifications than general recycled materials, they are expected to have high added value.

  • Currently, we are advancing PoCs* in various industries related to recycling.
    *PoC (Proof of Concept): Verification of the feasibility and effectiveness of new ideas.
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